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When consumers marvel at the smooth opening and closing experience and clear display effects of foldable screen phones, they may not realize that a technological breakthrough from the adhesive field plays a key role. Recently, by optimizing the characteristics of AB adhesive and lamination processes, the industry has successfully developed an ultra-thin tempered film solution suitable for foldable screens, breaking through the previously prohibited technical area in this field.

AB adhesive, as a classic two-component structural adhesive, has been widely used in automotive, electronic packaging, and model making fields for a long time due to its high bonding strength, excellent sealing properties, and aging resistance. However, when facing the new challenge of flexible displays, traditional AB adhesive encountered a bottleneck: how to achieve perfect bonding with ultra-thin flexible glass only 0.03mm thick, while withstanding hundreds of thousands of bends without generating bubbles or debonding?

According to reports, the latest technological breakthrough comes mainly from two aspects. The first is the functional optimization of AB adhesive's characteristics, enabling it to maintain high strength while possessing excellent flexibility and stress dissipation capabilities. The second is the revolutionary development of lamination processes, achieving "instant bubble elimination" functionality and solving the core problem of bubble residue in curved and flexible lamination. This enables substrate-free AB adhesive to bond tightly with ultra-thin glass, providing a reliable screen protection solution for foldable screen phones.

This progress is not only good news for the consumer electronics field but also marks a magnificent transformation of the traditional AB adhesive category towards high-tech application scenarios. Its technical principle—achieving the optimal balance between "strength" and "flexibility" through precise formula design and process control—provides valuable insights for adhesive applications in other fields such as flexible electronics and wearable devices.

In fact, the role of adhesives in electronics manufacturing is becoming increasingly central. From semiconductor packaging to AR/VR optical component manufacturing, to enhancing the sealing and lightweight performance of new energy vehicles, high-performance adhesives have become one of the fundamental materials for achieving product innovation and improving reliability. The industry is shifting from providing "bonding" functions to offering integrated "material solutions."