The 22nd Hot Melt Adhesive Innovation and Development Forum is about to convene, with the industry focusing on green and new energy opportunities
- Edit:Rongbang New Materials
- Date:2026-01-26
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The 22nd Hot Melt Adhesive Industry Innovation and Development Forum to be Held in Suzhou
At the beginning of the new year, a highly anticipated annual event in the industry is about to kick off. The reporter recently learned from the China Adhesives and Tape Industry Association that the 22nd Hot Melt Adhesive Industry Innovation and Development Forum is scheduled to be held from March 23 to 25, 2026, in Suzhou, Jiangsu Province. With the theme "Innovation-Driven Development for a Robust Hot Melt Adhesive Industry," this forum aims to explore the sustainable development and emerging market expansion of the hot melt adhesive industry under the background of the "dual carbon" goals and industrial upgrading.
At a critical juncture when the global economic landscape is undergoing profound adjustments and domestic manufacturing is advancing towards high-quality development, the hot melt adhesive industry is also facing transformational challenges and historical opportunities. The upcoming forum will systematically discuss core industry issues, including an in-depth analysis of the industry's development trajectory during the "14th Five-Year Plan" period and a forward-looking assessment of technological directions and market prospects for the "15th Five-Year Plan" period.
It is understood that the core content of the conference will focus on the industry's most cutting-edge technologies and innovative applications. On one hand, the forum will explore innovations in raw material systems for hot melt adhesives, particularly the application of bio-based/renewable resources in formulations, as well as R&D progress in degradable hot melt adhesives—indicating that the industry's green transformation is accelerating. On the other hand, industrial breakthroughs in high-performance products such as reactive polyurethane hot melt adhesive (PUR) will become key drivers propelling the industry towards high-end development.
Particularly noteworthy is that the diversified expansion of application markets is a key focus of this forum. Attending experts and corporate representatives will not only discuss how to achieve environmental upgrades and efficiency improvements in traditional fields such as hygiene products, packaging, and textiles, but will also concentrate on how to achieve breakthroughs in emerging strategic areas like new energy vehicles, photovoltaics, and consumer electronics, while exploring new growth opportunities in overseas markets. This indicates that the application boundaries of hot melt adhesives are rapidly extending from traditional manufacturing to high-tech industries.
At that time, representatives from domestic and international hot melt adhesive manufacturers, raw material suppliers, processing and application enterprises, as well as research institutions, will gather together for this grand event. Concurrently with the forum, a hot melt adhesive and raw materials exhibition will be held, providing a platform for direct exchange and cooperation across the industrial chain.

